90° Bending of flexible substrates

ESI is home to two 90° bending jigs: commercially available YUASA and the custom-build FLEX-E-TEST. Both instruments can be used to evaluate the bending resistance of materials used in flexible electronics, such as a foldable phone. Both include configurations to monitor the electrical resistance in-situ during bending.

FLEX-E-TEST

  • 2 configurations
  • Bending radii available: 20, 10, 5, 3, 2.5, 2, 1 mm
  • Maximum of 6 samples can be tested at the same time without in-situ resistance
  • In-situ resistance of 1 sample possible
  • Tensile, compressive, and mixed tensile-compressive bending possible
  • Intermittent characterization possible 

YUASA

  • 1 configuration
  • 2.5 mm bending radius
  • In-situ resistance possible
  • 1 sample
  • Only tensile bending possible
  • Intermittent characterization possible