The Hysitron (now Bruker) PI 95 Picoindenter is a state-of-the-art instrument that revolutionizes in situ nanomechanical mechanical testing in combination with our JEOL 2200FS transmission electron microscope. Hence, the PI 95 enables exploring the intricacies of material behavior under mechanical stress and opens a world of possibilities for scientific advancements and engineering breakthroughs.

At our institute, it is used at the forefront of nanoscale research, pushing the boundaries of materials science, nanotechnology, and semiconductor studies. Our work relies on cutting-edge tools and techniques that allow us to delve into the mechanical properties of materials at the smallest scales. This powerful combination brings forth unparalleled opportunities for nanoscale research and material characterization.

Key Features:

  • Unmatched precision and accuracy at the nanoscale
  • In situ imaging and mechanical testing
  • Visualization of the deformation and failure mechanisms
  • Versatile testing modes: indentation, compression, tension, and bending
  • Ultra-high-resolution force and displacement sensing
  • Nanoscale mechanical characterization


  • Maximal force 1 mN
  • Force noise floor <0.2 µN
  • Max displacement 1 µm
  • Displacement noise floor <1 nm
  • Feedback control rate 78 kHz
  • Maximal data acquisition rate 39 kHz


By leveraging the extraordinary capabilities of the Hysitron PI 95 Picoindenter integrated with a Transmission Electron Microscope, researchers at the Erich Schmid Institute are paving the way for groundbreaking discoveries in nanoscale science and engineering. Join us as we continue to push the boundaries of knowledge and unlock the limitless possibilities offered by this cutting-edge technology.


To get a preview of the current research facilitated by using the Hysitron PI 95 Picoindenter, we invite you to explore our recently published papers:

[1] D. Steinberger, I. Issa, R. Strobl, P.J. Imrich, D. Kiener, S. Sandfeld, Data-mining of in-situ TEM experiments: Towards understanding nanoscale fracture, Computational Materials Science. 216 (2023) 111830.
[2] I. Issa, C. Gammer, S. Kolitsch, A. Hohenwarter, P.J. Imrich, R. Pippan, D. Kiener, In-situ TEM investigation of toughening in Silicon at small scales, Materials Today. 48 (2021) 29–37.

[3] D. Kiener, J. Jeong, M. Alfreider, R. Konetschnik, S.H. Oh, Prospects of Using Small Scale Testing to Examine Different Deformation Mechanisms in Nanoscale Single Crystals—A Case Study in Mg, Crystals. 11 (2021) 61.

[4] I. Issa, A. Hohenwarter, R. Fritz, D. Kiener, Fracture properties of ultrafine grain chromium correlated to single dislocation processes at room temperature, Journal of Materials Research. 34 (2019) 2370–2383.