The purpose of the TEM sample preparation lab is to provide advanced tools and techniques for preparing high-quality, electron-transparent samples for detailed analysis in transmission electron microscopy. The lab is equipped with state-of-the-art instruments designed for precise and efficient sample preparation, ensuring high-quality results. These advanced tools support a wide range of materials and preparation techniques, optimizing workflows for a variety of applications. The general procedure involves shaping samples into 3 mm discs through punching or cutting, followed by clamping or gluing, then grinding, polishing, dimpling to ~10 µm thickness, and final thinning via ion milling to achieve electron transparency.














  1. MultiPrep™ System (8")
    • Functionality: Semi-automatic sample preparation with capabilities for parallel polishing, angle polishing, and site-specific polishing.
    • Features:
      • Dual micrometers for precise tilt adjustment (pitch and roll).
      • Rigid Z-indexing spindle to maintain geometric orientation during grinding and polishing.
      • Digital indicators for real-time monitoring or pre-setting material removal.
      • Adjustable rotation and oscillation speeds to maximize disc usage and minimize artifacts.
      • Load control for handling delicate to large samples.
         
  2. Olympus BX51 Light Microscope
    • Functionality: High-precision analysis of microstructures in materials science.
    • Features:
      • UIS2 optics for sharp, high-contrast imaging.
      • Supports multiple observation modes
      • with height measurement
         
  3. Model 3500 Premium Diamond Wire Saw
    • Functionality: Precision cutting of samples with minimal material loss.
    • Features:
      • Slotted plate and 360° rotatable stage for exact alignment.
      • Micrometers for accurate positioning and depth control.
      • Automatic shutdown upon reaching desired cut depth.
         
  4. Dimple Grinder II
    • Functionality: Mechanical pre-thinning method to near electron transparency, reducing ion milling time.
    • Features:
      • Creates large transparent areas with a strong rim for stability.
      • Real-time depth control and user-defined stop points.
      • Orthogonal and intersecting axis micro-positioning for precise sample handling.
      • Final thickness of <10 μm in dimpled specimens.
         
  5. Olympus SZX7 Stereomicroscope
    • Functionality: Visual inspection and sample positioning.
    • Features:
      • 7:1 zoom ratio for high-resolution imaging.
      • Ergonomic controls for user comfort.
      • Electrostatic discharge protection for sensitive samples.
         
  6. PIPS II System
    • Functionality: Precision ion polishing system for uniform thinning and damage-free preparation of TEM samples.
    • Features:
      • X-Y stage for aligning argon beams with the region of interest.
      • Collimated beam with voltages as low as 100 V for efficient and safe milling.
      • Integrated digital optical imaging with image storage and analysis via DigitalMicrograph®.
      • 10" color touchscreen for intuitive control of parameters.