Priv. Doz. Dr. Megan J. Cordill

Function: Vice Director
Room: 308
Phone: +43 (0) 3842-804-308
E-Mail: megan.cordill(at)


Complex Materials, Micro- and Nanomechanics, Micro- and Nanostructure Characterization


Nanoindentation, electro-mechanical in-situ testing, AFM, CLSM, electrical measurement, thin films, adhesion


Mechanics in Small Dimensions (Mechanik in kleinen Dimensionen), Übungen zu Materialkundliche Arbeitsverfahren


FLEX-E-TESTAdhesion Techniques for Films on Flexible SubstratesHigh cycle thermo-mechanical fatigue behavior of semiconductor thin filmsEPPL - Enhanced Power Pilot Line


  • Improved fracture resistance of Cu/Mo bilayers with thickness tailoring
    M. Cordill, T. Joerg, D. Toebbens, C. Mitterer
    Scr. Mater.202, ARTN 113994 (2021)
  • Self-Reducing Silver Ink on Polyurethane Elastomers for the Manufacture of Thin and Highly Stretchable Electrical Circuits
    K.K. Krawczyk, J. Groten, O. Glushko, M. Krivec, M. Fruehwirth, G. Schulz, C. Wolf, D. Hartmann, M. Moser, M.J. Cordill, B. Stadlober, T. Griesser
    Chem. Mat.33, 2742-2755 (2021)
  • Griffith's Legacy to Alloy Design and Beyond
    W.W. Gerberich, M.J. Cordill, J.W. Carter
    JOM2021, ARTN 4667-1 (2021)
  • Role of layer order on the equi-biaxial behavior of Al/Mo bilayers
    M.J. Cordill, P. Kreiml, B. Putz, C. Mitterer, D. Thiaudiere, C. Mocuta, P.-O. Renault, D. Faurie
    Scr. Mater.194, ARTN 113656 (2021)
  • Improved electro-mechanical reliability of flexible systems with alloyed Mo-Ta adhesion layers
    P. Kreiml, M. Rausch, L. Terziyska, H. Koestenbauer, J. Winkler, C. Mitterer, M. Cordill
    Thin Solid Films720, ARTN 138533 (2021)
  • Adhesion evaluation of thin films to dielectrics in multilayer stacks: A comparison of four-point bending and stressed overlayer technique
    A. Lassnig, B. Putz, S. Hirn, D.M. Toebbens, C. Mitterer, M.J. Cordill
    Mater. Des.200, ARTN 109451 (2021)
  • Direct determination of the area function for nanoindentation experiments
    C. Saringer, M. Tkadletz, M. Kratzer, M. Cordill
    J. Mater. Res.37, ARTN: 43578 (2021)
  • Microstructural Effects on the Interfacial Adhesion of Nanometer-Thick Cu Films on Glass Substrates: Implications for Microelectronic Devices
    A. Lassnig, V. Terziyska, J. Zalesak, T. Joerg, D. Toebbens, T. Griesser, C. Mitterer, R. Pippan, M. Cordill
  • Influence of the nitrogen content on the structure and properties of MoNbTaVW high entropy alloy thin films
    A. Xia, R. Dedoncker, O. Glushko, M. Cordill, D. Depla, R. Franz
    J. Alloy. Compd.850, ARTN 156740 (2021)
  • A new approach to evaluate the elastic modulus of metallic foils
    C.O.W. Trost, S. Wurster, C. Freitag, A. Steinberger, M.J. Cordill
    Mater. Des.196, ARTN 109149 (2020)