Priv. Doz. Dr. Megan J. Cordill
Function: Vice Director
Room: 308
Phone: +43 (0) 3842-804-308
E-Mail: megan.cordill(at)oeaw.ac.at
Research
Complex Materials, Micro- and Nanomechanics, Micro- and Nanostructure Characterization
Methods
Nanoindentation, electro-mechanical in-situ testing, AFM, CLSM, electrical measurement, thin films, adhesion
Teaching
Mechanics in Small Dimensions (Mechanik in kleinen Dimensionen), Übungen zu Materialkundliche Arbeitsverfahren
Projects
FLEX-E-TEST, Adhesion Techniques for Films on Flexible Substrates, High cycle thermo-mechanical fatigue behavior of semiconductor thin films, EPPL - Enhanced Power Pilot Line
Publications
- A Comparison of 90° Bending for Foldable ElectronicsCOATINGS14, ARTN 98 (2024)DOI RIS ENW BIB
- Annealing effects on Al/polyimide adhesion in flexible optical solar reflectorsMaterials Science and Engineering, 012006 (2023)DOI RIS ENW BIB
- Residual stress and thickness effects on fracture behavior of trilayer films during uniaxial loadingTHIN SOLID FILMS788, ARTN 140173 (2023)DOI RIS ENW BIB
- Refractory high entropy metal sublattice nitride thin films as diffusion barriers in Cu metallizationsSURF COAT TECH473, ARTN 130016 (2023)DOI RIS ENW BIB
- Rejuvenation engineering in metallic glasses by complementary stress and structure modulationNPG Asia Materials, 1-9 (2023)DOI RIS ENW BIB
- Tuning microstructure and properties of MoNbTaWZr high entropy alloy films by adjusting the parameters in high power impulse magnetron sputteringThin Solid Films, 140100 (2023)DOI RIS ENW BIB
- Adhesion of WTi to polyimide measured by complementary methodsSurface & Coatings Technology, 130148 (2023)DOI RIS ENW BIB
- Creep-dominated fatigue of freestanding gold thin films studied by bulge testingMAT SCI ENG A-STRUCT887, ARTN 145759 (2023)DOI RIS ENW BIB
- Nanoscale printed tunable specimen geometry enables high-throughput miniaturized fracture testingMaterials & Design, 112329 (2023)DOI RIS ENW BIB
- A new design rule for high entropy alloy diffusion barriers in Cu metallizationJ ALLOY COMPD953, ARTN 170166 (2023)DOI RIS ENW BIB