The institute's clean room is a class 10000 (according to U.S. Federal Standard 209e) certified laboratory with a total area of 30 m². It is used for flight hardware assembling and testing and accommodates up to six engineers.
The laminar flow clean bench has its own filtered air supply. It provides product protection by ensuring that the work piece in the bench is exposed only to HEPA-filtered air (HEPA = High Efficiency Particulate Air). The internal dimensions are 1180 x 600 x 560 mm.
The vapor phase soldering machine is suitable for mid size volume production. The maximum board size is 340 x 300 x 80 mm. Vapor phase soldering is currently the most flexible, simplest and most reliable method of soldering. It is ideally suited for all types of surface mounted device (SMD) components and base materials. It allows processing of all components without the need of any complicated calculations or having to maintain temperature profiles. For the placing of fine pitch parts and the rework of electronic boards an infrared soldering and precision placing system is used.
The new DispenseMate 585 is a solder paste printer in a compact benchtop format. This machine allows a precise dosing of solder pastes on PCBs. As an option, a dispenser for precise glue application can be used. The range of motion is 525 x 525 mm.