Semiconductor packaging : : materials interaction and reliability / / Andrea Chen, Randy Hsiao-Yu Lo.

• VerfasserIn: Chen, Andrea.,
• TeilnehmendeR: Lo, Randy.
• Place / Publishing House: Boca Raton, Fla. : : CRC Press,, 2012.
• Year of Publication: 2012
• Edición: 1st edition
• Idioma: English
• Descrición Física: 1 online resource (208 p.)
• Notas: Description based upon print version of record.

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the...