Electromigration in ULSI interconnections / Cher Ming Tan.
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Superior document: | International series on advances in solid state electronics and technology (ASSET) |
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Year of Publication: | 2010 |
Language: | English |
Series: | International series on advances in solid state electronics and technology.
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Online Access: | |
Physical Description: | xix, 291 p. :; ill. (some col.), col. port. |
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050 | 4 | |a TK7874.76 |b .T36 2010 | |
100 | 1 | |a Tan, Cher Ming, |d 1959- | |
245 | 1 | 0 | |a Electromigration in ULSI interconnections |h [electronic resource] / |c Cher Ming Tan. |
260 | |a Hackensack, N.J. : |b World Scientific, |c c2010. | ||
300 | |a xix, 291 p. : |b ill. (some col.), col. port. | ||
490 | 1 | |a International series on advances in solid state electronics and technology (ASSET) | |
504 | |a Includes bibliographical references and index. | ||
533 | |a Electronic reproduction. Ann Arbor, MI : ProQuest, 2015. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries. | ||
650 | 0 | |a Integrated circuits |x Ultra large scale integration. | |
650 | 0 | |a Electrodiffusion. | |
655 | 4 | |a Electronic books. | |
710 | 2 | |a ProQuest (Firm) | |
830 | 0 | |a International series on advances in solid state electronics and technology. | |
856 | 4 | 0 | |u https://ebookcentral.proquest.com/lib/oeawat/detail.action?docID=731200 |z Click to View |