Electromigration in ULSI interconnections / Cher Ming Tan.

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Bibliographic Details
Superior document:International series on advances in solid state electronics and technology (ASSET)
:
TeilnehmendeR:
Year of Publication:2010
Language:English
Series:International series on advances in solid state electronics and technology.
Online Access:
Physical Description:xix, 291 p. :; ill. (some col.), col. port.
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100 1 |a Tan, Cher Ming,  |d 1959- 
245 1 0 |a Electromigration in ULSI interconnections  |h [electronic resource] /  |c Cher Ming Tan. 
260 |a Hackensack, N.J. :  |b World Scientific,  |c c2010. 
300 |a xix, 291 p. :  |b ill. (some col.), col. port. 
490 1 |a International series on advances in solid state electronics and technology (ASSET) 
504 |a Includes bibliographical references and index. 
533 |a Electronic reproduction. Ann Arbor, MI : ProQuest, 2015. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries. 
650 0 |a Integrated circuits  |x Ultra large scale integration. 
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655 4 |a Electronic books. 
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830 0 |a International series on advances in solid state electronics and technology. 
856 4 0 |u https://ebookcentral.proquest.com/lib/oeawat/detail.action?docID=731200  |z Click to View