Priv. Doz. Dr. Megan J. Cordill

Function: Vice Director
Room: 308
Phone: +43 (0) 3842-804-308
E-Mail: megan.cordill(at)oeaw.ac.at

Research

Complex Materials, Micro- and Nanomechanics, Micro- and Nanostructure Characterization

Methods

Nanoindentation, electro-mechanical in-situ testing, AFM, CLSM, electrical measurement, thin films, adhesion

Teaching

Mechanics in Small Dimensions (Mechanik in kleinen Dimensionen), Übungen zu Materialkundliche Arbeitsverfahren

Projects

FLEX-E-TEST, Adhesion Techniques for Films on Flexible Substrates, High cycle thermo-mechanical fatigue behavior of semiconductor thin films, EPPL - Enhanced Power Pilot Line

Publications

  • Thickness effect on the fracture and delamination of titanium films
    M.J. Cordill, A.A. Taylor
    Thin Solid Films589, 209-214 (2015)
    DOIRISENWBIB
  • Adhesion measurement of a buried Cr interlayer on polyimide
    V.M. Marx, C. Kirchlechner, . Zizak, M.J. Cordill, G. Dehm
    Philos. Mag.95, 1982-1991 (2015)
    DOIRISENWBIB
  • Improved electro-mechanical performance of gold films on polyimide without adhesion layers
    B. Putz, R.L. Schoeppner, O. Glushko, D.F. Bahr, M.J. Cordill
    Scr. Mater.102, 23-26 (2015)
    DOIRISENWBIB
  • Studying the Electro-Mechanical Behavior of Thin Films
    M.J. Cordill, O. Glushko
    Olympus Application note (2015)
    RISENWBIB
  • Mechanical and chemical investigation of the interface between tungsten-based metallizations and annealed borophosphosilicate glass
    B. Voelker, W. Heinz, K. Matoy, R. Roth, J.M. Batke, T. Schoeberl, M.J. Cordill, G. Dehm
    Thin Solid Films583, 170-176 (2015)
    DOIRISENWBIB
  • Downscaling metal-dielectric interface fracture experiments to sub-micron dimensions: A feasibility study using TEM
    B. Voelker, W. Heinz, R. Roth, J.M. Batke, M.J. Cordill, G. Dehm
    Surf. Coat. Technol.270, 1-7 (2015)
    DOIRISENWBIB
  • Methods to measure the adhesion of metal-polymer interfaces
    M.J. Cordill
     (2015)
    RISENWBIB
  • The influence of a brittle Cr interlayer on the deformation behavior of thin Cu films on flexible substrates: Experiment and model
    V.M. Marx, F. Toth, A. Wiesinger, J. Berger, C. Kirchlechner, M.J. Cordill, F.D. Fischer, F.G. Rammerstorfer, G. Dehm
    Acta Mater.89, 278-289 (2015)
    DOIRISENWBIB
  • Following crack path selection in multifilm structures with weak and strong interfaces by in situ 4-point-bending
    B. Voelker, S. Venkatesan, W. Heinz, K. Matoy, R. Roth, J.M. Batke, M.J. Cordill, G. Dehm
    J. Mater. Res.30, 1090-1097 (2015)
    DOIRISENWBIB
  • Measuring electro-mechanical properties of thin films on polymer substrates
    M.J. Cordill, O. Glushko, J. Kreith, V.M. Marx, C. Kirchlechner
    Microelectron. Eng.137, 96-100 (2015)
    DOIRISENWBIB