Priv. Doz. Dr. Megan J. Cordill

Function: Vice Director
Room: 308
Phone: +43 (0) 3842-804-308
E-Mail: megan.cordill(at)


Complex Materials, Micro- and Nanomechanics, Micro- and Nanostructure Characterization


Nanoindentation, electro-mechanical in-situ testing, AFM, CLSM, electrical measurement, thin films, adhesion


Mechanics in Small Dimensions (Mechanik in kleinen Dimensionen), Übungen zu Materialkundliche Arbeitsverfahren


FLEX-E-TESTAdhesion Techniques for Films on Flexible SubstratesHigh cycle thermo-mechanical fatigue behavior of semiconductor thin filmsEPPL - Enhanced Power Pilot Line


  • Electromigration in Gold Films on Flexible Polyimide Substrates as a Self-healing Mechanism
    B. Putz, O. Glushko, M.J. Cordill
  • Effect of Microstructure on the Electro-Mechanical Behaviour of Cu Films on Polyimide
    J. Berger, O. Glushko, V.M. Marx, C. Kirchlechner, M.J. Cordill
    JOM68, 1640-1646 (2016)
  • The electro-mechanical behavior of sputter-deposited Mo thin films on flexible substrates
    T. Joerg, M.J. Cordill, R. Franz, O. Glushko, J. Winkler, C. Mitterer
    Thin Solid Films606, 45-50 (2016)
  • Relationship between mechanical damage and electrical degradation in polymer-supported metal films subjected to cyclic loading
    O. Glushko, A. Klug, E.J.W. List-Kratochvil, M.J. Cordill
    Mater. Sci. Eng. A-Struct. Mater. Prop. Microstruct. Process.662, 157-161 (2016)
  • Electro-Mechanical Testing of Conductive Materials Used in Flexible Electronics
    M.J. Cordill, O. Glushko, B. Putz
  • The effect of bending loading conditions on the reliability of inkjet printed and evaporated silver metallization on polymer substrates
    O. Glushko, M.J. Cordill, A. Klug, E.J.W. List-Kratochvil
    Microelectron. Reliab.56, 109-113 (2016)
  • High-Temperature Characterization of Silicon Dioxide Films with Wafer Curvature
    S. Bigl, W. Heinz, M. Kahn, H. Schoenherr, M.J. Cordill
    JOM67, 2902-2907 (2015)
  • Residual stress within nanoscale metallic multilayer systems during thermal cycling
    D.R. Economy, M.J. Cordill, E.A. Payzant, M.S. Kennedy
    Mater. Sci. Eng. A-Struct. Mater. Prop. Microstruct. Process.648, 289-298 (2015)
  • Adhesion energy of printed circuit board materials using four-point-bending validated with finite element simulations
    R. Schöngrundner, M.J. Cordill, G.A. Maier, H.-P. Gänser
    Microelectronics Reliability, 2382-2390 (2015)
  • In situ testing of flexible electronics: an alternative to AFM
    M.J. Cordill, M. Fabich
    Electronic Engineering Times Europe, 36-37 (2015)