Priv. Doz. Dr. Megan J. Cordill

Function: Vice Director
Room: 308
Phone: +43 (0) 3842-804-308
E-Mail: megan.cordill(at)


Complex Materials, Micro- and Nanomechanics, Micro- and Nanostructure Characterization


Nanoindentation, electro-mechanical in-situ testing, AFM, CLSM, electrical measurement, thin films, adhesion


Mechanics in Small Dimensions (Mechanik in kleinen Dimensionen), Übungen zu Materialkundliche Arbeitsverfahren


FLEX-E-TESTAdhesion Techniques for Films on Flexible SubstratesHigh cycle thermo-mechanical fatigue behavior of semiconductor thin filmsEPPL - Enhanced Power Pilot Line


  • The driving force governing room temperature grain coarsening in thin gold films
    O. Glushko, M.J. Cordill
    Scripta Materialia130, 42-45 (2017)
  • Rapid fabrication of function-structure-integrated NiTi alloys: Towards a combination of excellent superelasticity and favorable bioactivity
    L. Zhang, Z.Y. He, J. Tan, Y.Q. Zhang, M. Stoica, K.G. Prashanth, M.J. Cordill, Y.H. Jiang, R. Zhou, J. Eckert
    Intermetallics82, 1-13 (2017)
  • Effect of annealing on the size dependent deformation behavior of thin cobalt films on flexible substrates
    V.M. Marx, M.J. Cordill, D.M. Toebbens, C. Kirchlechner, G. Dehm
    Thin Solid Films624, 34-40 (2017)
  • Accelerated thermo-mechanical fatigue of copper metallizations studied by pulsed laser heating
    S. Wurster, S. Bigl, M.J. Cordill, D. Kiener
    Microelectronic Engineering167, 110-118 (2017)
  • Buckle induced delamination techniques to measure the adhesion of metal dielectric interfaces
    A. Kleinbichler, J. Zechner, M.J. Cordill
    Microelectron. Eng.167, 63-68 (2017)
  • Influence of extreme thermal cycling on metal-polymer interfaces
    B. Putz, B. Voelker, C. Semprimoschnig, M.J. Cordill
    Microelectron. Eng.167, 17-22 (2017)
  • Correlative microstructure and topography informed nanoindentation of copper films
    S. Bigl, T. Schöberl, S. Wurster, M.J. Cordill, D. Kiener
    Surface & Coatings Technology, 404-413 (2016)
  • Strain-induced phase transformation of a thin Co film on flexible substrates
    V.M. Marx, C. Kirchlechner, B. Breitbach, M.J. Cordill, D.M. Toebbens, T. Waitz, G. Dehm
    Acta Mater.121, 227-233 (2016)
  • Advanced 3D failure characterization in multi-layered PCBs
    E. Gruenwald, R. Hammer, J. Rosc, G.A. Maier, M. Baernthaler, M.J. Cordill, S. Brand, R. Nuster, T. Krivec, R. Brunner
    NDT E Int.84, 99-107 (2016)
  • Advanced characterisation of thermo-mechanical fatigue mechanisms of different copper film systems for wafer metallizations
    S. Bigl, S. Wurster, M.J. Cordill, D. Kiener
    Thin Solid Films612, 153-164 (2016)