Priv. Doz. Dr. Megan J. Cordill

Function: Vice Director
Room: 308
Phone: +43 (0) 3842-804-308
E-Mail: megan.cordill(at)oeaw.ac.at

Research

Complex Materials, Micro- and Nanomechanics, Micro- and Nanostructure Characterization

Methods

Nanoindentation, electro-mechanical in-situ testing, AFM, CLSM, electrical measurement, thin films, adhesion

Teaching

Mechanics in Small Dimensions (Mechanik in kleinen Dimensionen), Übungen zu Materialkundliche Arbeitsverfahren

Projects

FLEX-E-TEST, Adhesion Techniques for Films on Flexible Substrates, High cycle thermo-mechanical fatigue behavior of semiconductor thin films, EPPL - Enhanced Power Pilot Line

Publications

  • Interfacial mutations in the Al-polyimide system
    B. Putz, G. Milassin, Y. Butenko, B. Voelker, C. Gammer, C. Semprimoschnig, M.J. Cordill
    Surf. Interface Anal.50, 579-586 (2018)
    DOIRISENWBIB
  • Two-stage cracking of metallic bi-layers on polymer substrates under tension
    B. Putz, C. May-Miller, V. Matl, B. Völker, D.M. Többens, C. Semprimoschnig, M.J. Cordill
    Scripta Materialia145, 5-8 (2018)
    DOIRISENWBIB
  • Precipitate strengthening and thermal stability in three component metallic nanolaminate thin films
    R.L. Schoeppner, A.A. Taylor, M.J. Cordill, H.M. Zbib, J. Michler, D.F. Bahr
    Mater. Sci. Eng. A-Struct. Mater. Prop. Microstruct. Process., 485-492 (2018)
    DOIRISENWBIB
  • Electrically reversible cracks in an intermetallic film controlled by an electric field
    Z.Q. Liu, J.H. Liu, M.D. Biegalski, J.-M. Hu, S.L. Shang, Y. Ji, J.M. Wang, S.L. Hsu, A.T. Wong, M.J. Cordill, B. Gludovatz, C. Marker, H. Yan, Z.X. Feng, L. You, M.W. Lin, T.Z. Ward, Z.K. Liu, C.B. Jiang, L.Q. Chen, R.O. Ritchie, H.M. Christen, R. Ramesh
    Nat. Commun., ARTN 41 (2018)
    DOIRISENWBIB
  • Microstructural influence on the cyclic electro-mechanical behaviour of ductile films on polymer substrates
    M.J. Cordill, O. Glushko, A. Kleinbichler, B. Putz, D.M. Toebbens, C. Kirchlechner
    Thin Solid Films644, 166-172 (2017)
    DOIRISENWBIB
  • Combined TEM and XPS studies of metal - polymer interfaces for space applications
    B. Putz, G. Milassin, Y. Butenko, B. Völker, C. Gammer, C. Semprimoschnig, M.J. Cordill
    Surface and Coatings Technology332, 368-375 (2017)
    DOIRISENWBIB
  • Annealing effects on the film stress and adhesion of tungsten-titanium barrier layers
    A. Kleinbichler, J. Todt, J. Zechner, S. Wöhlert, D.M. Többens, M.J. Cordill
    Surface and Coatings Technology332, 376-381 (2017)
    DOIRISENWBIB
  • Inkjet Printed Wiring Boards with Vertical Interconnect Access on Flexible, Fully Compostable Cellulose Substrates
    A. Samusjew, A. Lassnig, M.J. Cordill, K.K. Krawczyk, T. Griesser
    Advanced Materials Technologies2017, ARTN 1700250 (2017)
    DOIRISENWBIB
  • New Insights into Nanoindentation-Based Adhesion Testing
    A. Kleinbichler, M.J. Pfeifenberger, J. Zechner, N.R. Moody, D.F. Bahr, M.J. Cordill
    JOM69, 2237-2245 (2017)
    DOIRISENWBIB
  • Substrate-Influenced Thermo-Mechanical Fatigue of Copper Metallizations: Limits of Stoney's Equation
    S. Bigl, S. Wurster, M.J. Cordill, D. Kiener
    Materials10, ARTN 1287 (2017)
    DOIRISENWBIB