The ENIAC Joint Undertaking (JU) project EPPL - Enhanced Power Pilot Line brings together large industry with small and medium enterprises, high-tech research institutes and leading European universities. EPPL will demonstrate the market readiness of next generation power semiconductor devices fabricated in European leading 300mm pilot lines, enabling manufacturing excellence to serve challenging applications. The ENIAC JU project EPPL will combine research, development and innovation to demonstrate market readiness by industrial implementation at an early stage. Thermo-mechanical fatigue & fracture behavior of thin films and interfaces is investigated at the Erich Schmid Institute / Department of Materials Physics. Various in situ heating and stress measurement techniques on metallized wafers and more complex structures are applied. Evolving material damage is investigated with scanning and transmission electron microscopy techniques in a site-specific way. Generated defects can be identified and characterized.