Priv. Doz. Dr. Megan J. Cordill

Function: Vice Director
Room: 308
Phone: +43 (0) 3842-804-308
E-Mail: megan.cordill(at)oeaw.ac.at

Research

Complex Materials, Micro- and Nanomechanics, Micro- and Nanostructure Characterization

Methods

Nanoindentation, electro-mechanical in-situ testing, AFM, CLSM, electrical measurement, thin films, adhesion

Teaching

Mechanics in Small Dimensions (Mechanik in kleinen Dimensionen), Übungen zu Materialkundliche Arbeitsverfahren

Projects

FLEX-E-TESTAdhesion Techniques for Films on Flexible SubstratesHigh cycle thermo-mechanical fatigue behavior of semiconductor thin filmsEPPL - Enhanced Power Pilot Line

Publications

  • Measuring electro-mechanical properties of thin films on polymer substrates
    M.J. Cordill, O. Glushko, J. Kreith, V.M. Marx, C. Kirchlechner
    Microelectron. Eng.137, 96-100 (2015)
  • Megan Cordill Finds "Piece" in Quilting
    M.J. Cordill
    JOM, 540-541 (2014)
  • Electrical Resistance Decrease Due to Grain Coarsening Under Cyclic Deformation
    O. Glushko, M.J. Cordill
    JOM, 598-601 (2014)
  • Recovery of electrical resistance in copper films on polyethylene terephthalate subjected to a tensile strain
    O. Glushko, V.M. Marx, C. Kirchlechner, I. Zizak, M.J. Cordill
    Thin Solid Films, 141-145 (2014)
  • Electrical Resistance of Metal Films on Polymer Substrates Under Tension
    O. Glushko, M.J. Cordill
    Experimental Techniques, 1-8 (2014)
  • Fragmentation testing for ductile thin films on polymer substrates
    M.J. Cordill, V.M. Marx
    Philosophical Magazine Letters, 618-624 (2013)
  • In-situ tensile straining of metal films on polymer substrates under an AFM
    M.J. Cordill, V.M. Marx
    (2013)
  • United in Our Differences: Changing the Face of MSE
    M.J. Cordill
    JOM, 828 (2013)
  • Adhesion of Printed Circuit Boards with bending and the effect of reflow cycles
    M.J. Cordill, R. Schöngrundner, H.P. Krückl, T. Krivec, M. Kurz, G. Maier
    IEEE Catalog Number CFP13566-CDR, ed. ISBN 978-1-4673-6137-8, 1-8 (2013)
  • Detailed modelling of delamination buckling of thin films under global tension
    R.F.G. Toth F.
    Acta Materialia, 2425-2433 (2013)