Priv. Doz. Dr. Megan J. Cordill
Function: Vice Director
Room: 308
Phone: +43 (0) 3842-804-308
E-Mail: megan.cordill(at)oeaw.ac.at
Research
Complex Materials, Micro- and Nanomechanics, Micro- and Nanostructure Characterization
Methods
Nanoindentation, electro-mechanical in-situ testing, AFM, CLSM, electrical measurement, thin films, adhesion
Teaching
Mechanics in Small Dimensions (Mechanik in kleinen Dimensionen), Übungen zu Materialkundliche Arbeitsverfahren
Projects
FLEX-E-TEST, Adhesion Techniques for Films on Flexible Substrates, High cycle thermo-mechanical fatigue behavior of semiconductor thin films, EPPL - Enhanced Power Pilot Line
Publications
- Electro-Mechanical Testing of Conductive Materials Used in Flexible Electronics
FRONTIERS IN MATERIALS3, UNSP 11 (2016) - The effect of bending loading conditions on the reliability of inkjet printed and evaporated silver metallization on polymer substrates
Microelectron. Reliab.56, 109-113 (2016) - High-Temperature Characterization of Silicon Dioxide Films with Wafer Curvature
JOM67, 2902-2907 (2015) - Residual stress within nanoscale metallic multilayer systems during thermal cycling
Mater. Sci. Eng. A-Struct. Mater. Prop. Microstruct. Process.648, 289-298 (2015) - Adhesion energy of printed circuit board materials using four-point-bending validated with finite element simulations
Microelectronics Reliability, 2382-2390 (2015) - In situ testing of flexible electronics: an alternative to AFM
Electronic Engineering Times Europe, 36-37 (2015) - Thickness effect on the fracture and delamination of titanium films
Thin Solid Films589, 209-214 (2015) - Adhesion measurement of a buried Cr interlayer on polyimide
Philos. Mag.95, 1982-1991 (2015) - Improved electro-mechanical performance of gold films on polyimide without adhesion layers
Scr. Mater.102, 23-26 (2015) - Studying the Electro-Mechanical Behavior of Thin Films
Olympus Application note (2015)