Priv. Doz. Dr. Megan J. Cordill

Function: Vice Director
Room: 308
Phone: +43 (0) 3842-804-308
E-Mail: megan.cordill(at)oeaw.ac.at

Research

Complex Materials, Micro- and Nanomechanics, Micro- and Nanostructure Characterization

Methods

Nanoindentation, electro-mechanical in-situ testing, AFM, CLSM, electrical measurement, thin films, adhesion

Teaching

Mechanics in Small Dimensions (Mechanik in kleinen Dimensionen), Übungen zu Materialkundliche Arbeitsverfahren

Projects

FLEX-E-TESTAdhesion Techniques for Films on Flexible SubstratesHigh cycle thermo-mechanical fatigue behavior of semiconductor thin filmsEPPL - Enhanced Power Pilot Line

Publications

  • Electro-Mechanical Testing of Conductive Materials Used in Flexible Electronics
    M.J. Cordill, O. Glushko, B. Putz
    FRONTIERS IN MATERIALS3, UNSP 11 (2016)
  • The effect of bending loading conditions on the reliability of inkjet printed and evaporated silver metallization on polymer substrates
    O. Glushko, M.J. Cordill, A. Klug, E.J.W. List-Kratochvil
    Microelectron. Reliab.56, 109-113 (2016)
  • High-Temperature Characterization of Silicon Dioxide Films with Wafer Curvature
    S. Bigl, W. Heinz, M. Kahn, H. Schoenherr, M.J. Cordill
    JOM67, 2902-2907 (2015)
  • Residual stress within nanoscale metallic multilayer systems during thermal cycling
    D.R. Economy, M.J. Cordill, E.A. Payzant, M.S. Kennedy
    Mater. Sci. Eng. A-Struct. Mater. Prop. Microstruct. Process.648, 289-298 (2015)
  • Adhesion energy of printed circuit board materials using four-point-bending validated with finite element simulations
    R. Schöngrundner, M.J. Cordill, G.A. Maier, H.-P. Gänser
    Microelectronics Reliability, 2382-2390 (2015)
  • In situ testing of flexible electronics: an alternative to AFM
    M.J. Cordill, M. Fabich
    Electronic Engineering Times Europe, 36-37 (2015)
  • Thickness effect on the fracture and delamination of titanium films
    M.J. Cordill, A.A. Taylor
    Thin Solid Films589, 209-214 (2015)
  • Adhesion measurement of a buried Cr interlayer on polyimide
    V.M. Marx, C. Kirchlechner, . Zizak, M.J. Cordill, G. Dehm
    Philos. Mag.95, 1982-1991 (2015)
  • Improved electro-mechanical performance of gold films on polyimide without adhesion layers
    B. Putz, R.L. Schoeppner, O. Glushko, D.F. Bahr, M.J. Cordill
    Scr. Mater.102, 23-26 (2015)
  • Studying the Electro-Mechanical Behavior of Thin Films
    M.J. Cordill, O. Glushko
    Olympus Application note (2015)