
Priv. Doz. Dr. Megan J. Cordill
Function: Vice Director
Room: 308
Phone: +43 (0) 3842-804-308
E-Mail: megan.cordill(at)oeaw.ac.at
Research
Complex Materials, Micro- and Nanomechanics, Micro- and Nanostructure Characterization
Methods
Nanoindentation, electro-mechanical in-situ testing, AFM, CLSM, electrical measurement, thin films, adhesion
Teaching
Mechanics in Small Dimensions (Mechanik in kleinen Dimensionen), Übungen zu Materialkundliche Arbeitsverfahren
Projects
FLEX-E-TEST, Adhesion Techniques for Films on Flexible Substrates, High cycle thermo-mechanical fatigue behavior of semiconductor thin films, EPPL - Enhanced Power Pilot Line
Publications
- In situ testing of flexible electronics: an alternative to AFM
Electronic Engineering Times Europe, 36-37 (2015) - Thickness effect on the fracture and delamination of titanium films
Thin Solid Films589, 209-214 (2015) - Adhesion measurement of a buried Cr interlayer on polyimide
Philos. Mag.95, 1982-1991 (2015) - Improved electro-mechanical performance of gold films on polyimide without adhesion layers
Scr. Mater.102, 23-26 (2015) - Studying the Electro-Mechanical Behavior of Thin Films
Olympus Application note (2015) - Mechanical and chemical investigation of the interface between tungsten-based metallizations and annealed borophosphosilicate glass
Thin Solid Films583, 170-176 (2015) - Downscaling metal-dielectric interface fracture experiments to sub-micron dimensions: A feasibility study using TEM
Surf. Coat. Technol.270, 1-7 (2015) - Methods to measure the adhesion of metal-polymer interfaces
(2015) - The influence of a brittle Cr interlayer on the deformation behavior of thin Cu films on flexible substrates: Experiment and model
Acta Mater.89, 278-289 (2015) - Following crack path selection in multifilm structures with weak and strong interfaces by in situ 4-point-bending
J. Mater. Res.30, 1090-1097 (2015)