Priv. Doz. Dr. Megan J. Cordill
Function: Vice Director
Room: 308
Phone: +43 (0) 3842-804-308
E-Mail: megan.cordill(at)oeaw.ac.at
Research
Complex Materials, Micro- and Nanomechanics, Micro- and Nanostructure Characterization
Methods
Nanoindentation, electro-mechanical in-situ testing, AFM, CLSM, electrical measurement, thin films, adhesion
Teaching
Mechanics in Small Dimensions (Mechanik in kleinen Dimensionen), Übungen zu Materialkundliche Arbeitsverfahren
Projects
FLEX-E-TEST, Adhesion Techniques for Films on Flexible Substrates, High cycle thermo-mechanical fatigue behavior of semiconductor thin films, EPPL - Enhanced Power Pilot Line
Publications
- Effect of annealing on the size dependent deformation behavior of thin cobalt films on flexible substrates
Thin Solid Films624, 34-40 (2017) - Accelerated thermo-mechanical fatigue of copper metallizations studied by pulsed laser heating
Microelectronic Engineering167, 110-118 (2017) - Buckle induced delamination techniques to measure the adhesion of metal dielectric interfaces
Microelectron. Eng.167, 63-68 (2017) - Influence of extreme thermal cycling on metal-polymer interfaces
Microelectron. Eng.167, 17-22 (2017) - Correlative microstructure and topography informed nanoindentation of copper films
Surface & Coatings Technology, 404-413 (2016) - Strain-induced phase transformation of a thin Co film on flexible substrates
Acta Mater.121, 227-233 (2016) - Advanced 3D failure characterization in multi-layered PCBs
NDT E Int.84, 99-107 (2016) - Advanced characterisation of thermo-mechanical fatigue mechanisms of different copper film systems for wafer metallizations
Thin Solid Films612, 153-164 (2016) - Electromigration in Gold Films on Flexible Polyimide Substrates as a Self-healing Mechanism
MATERIALS RESEARCH LETTERS4, 43-47 (2016) - Effect of Microstructure on the Electro-Mechanical Behaviour of Cu Films on Polyimide
JOM68, 1640-1646 (2016)