Priv. Doz. Dr. Megan J. Cordill

Function: Vice Director
Room: 308
Phone: +43 (0) 3842-804-308
E-Mail: megan.cordill(at)oeaw.ac.at

Research

Complex Materials, Micro- and Nanomechanics, Micro- and Nanostructure Characterization

Methods

Nanoindentation, electro-mechanical in-situ testing, AFM, CLSM, electrical measurement, thin films, adhesion

Teaching

Mechanics in Small Dimensions (Mechanik in kleinen Dimensionen), Übungen zu Materialkundliche Arbeitsverfahren

Projects

FLEX-E-TESTAdhesion Techniques for Films on Flexible SubstratesHigh cycle thermo-mechanical fatigue behavior of semiconductor thin filmsEPPL - Enhanced Power Pilot Line

Publications

  • A versatile atomic force microscope integrated with a scanning electron microscope
    J. Kreith, T. Strunz, E.J. Fantner, G.E. Fantner, M.J. Cordill
    Rev. Sci. Instrum.88, ARTN 053704 (2017)
  • Explicit relationship between electrical and topological degradation of polymer-supported metal films subjected to mechanical loading
    O. Glushko, P. Kraker, M.J. Cordill
    Appl. Phys. Lett.110, ARTN 191904 (2017)
  • Thin film adhesion of flexible electronics influenced by interlayers
    A. Kleinbichler, M. Bartosik, B. Völker, M.J. Cordill
    Advanced Engineering Materials19, 1-7 (2017)
  • Electro-mechanical performance of thin gold films on polyimide
    B. Putz, O. Glushko, V.M. Marx, C. Kirchlechner, D. Toebbens, M.J. Cordill
    MRS ADVANCES1, 773-778 (2017)
  • The driving force governing room temperature grain coarsening in thin gold films
    O. Glushko, M.J. Cordill
    Scripta Materialia130, 42-45 (2017)
  • Rapid fabrication of function-structure-integrated NiTi alloys: Towards a combination of excellent superelasticity and favorable bioactivity
    L. Zhang, Z.Y. He, J. Tan, Y.Q. Zhang, M. Stoica, K.G. Prashanth, M.J. Cordill, Y.H. Jiang, R. Zhou, J. Eckert
    Intermetallics82, 1-13 (2017)
  • Effect of annealing on the size dependent deformation behavior of thin cobalt films on flexible substrates
    V.M. Marx, M.J. Cordill, D.M. Toebbens, C. Kirchlechner, G. Dehm
    Thin Solid Films624, 34-40 (2017)
  • Accelerated thermo-mechanical fatigue of copper metallizations studied by pulsed laser heating
    S. Wurster, S. Bigl, M.J. Cordill, D. Kiener
    Microelectronic Engineering167, 110-118 (2017)
  • Buckle induced delamination techniques to measure the adhesion of metal dielectric interfaces
    A. Kleinbichler, J. Zechner, M.J. Cordill
    Microelectron. Eng.167, 63-68 (2017)
  • Influence of extreme thermal cycling on metal-polymer interfaces
    B. Putz, B. Voelker, C. Semprimoschnig, M.J. Cordill
    Microelectron. Eng.167, 17-22 (2017)