Priv. Doz. Dr. Megan J. Cordill

Function: Vice Director
Room: 308
Phone: +43 (0) 3842-804-308
E-Mail: megan.cordill(at)


Complex Materials, Micro- and Nanomechanics, Micro- and Nanostructure Characterization


Nanoindentation, electro-mechanical in-situ testing, AFM, CLSM, electrical measurement, thin films, adhesion


Mechanics in Small Dimensions (Mechanik in kleinen Dimensionen), Übungen zu Materialkundliche Arbeitsverfahren


FLEX-E-TESTAdhesion Techniques for Films on Flexible SubstratesHigh cycle thermo-mechanical fatigue behavior of semiconductor thin filmsEPPL - Enhanced Power Pilot Line


  • Combined TEM and XPS studies of metal - polymer interfaces for space applications
    B. Putz, G. Milassin, Y. Butenko, B. Völker, C. Gammer, C. Semprimoschnig, M.J. Cordill
    Surface and Coatings Technology332, 368-375 (2017)
  • Annealing effects on the film stress and adhesion of tungsten-titanium barrier layers
    A. Kleinbichler, J. Todt, J. Zechner, S. Wöhlert, D.M. Többens, M.J. Cordill
    Surface and Coatings Technology332, 376-381 (2017)
  • Inkjet Printed Wiring Boards with Vertical Interconnect Access on Flexible, Fully Compostable Cellulose Substrates
    A. Samusjew, A. Lassnig, M.J. Cordill, K.K. Krawczyk, T. Griesser
    Advanced Materials Technologies2017, ARTN 1700250 (2017)
  • New Insights into Nanoindentation-Based Adhesion Testing
    A. Kleinbichler, M.J. Pfeifenberger, J. Zechner, N.R. Moody, D.F. Bahr, M.J. Cordill
    JOM69, 2237-2245 (2017)
  • Substrate-Influenced Thermo-Mechanical Fatigue of Copper Metallizations: Limits of Stoney's Equation
    S. Bigl, S. Wurster, M.J. Cordill, D. Kiener
    Materials10, ARTN 1287 (2017)
  • Die Elektronik dehnen, bis sie bricht
    V. Schmidt
    Die Presse (2017)
  • A correlative experimental and ab initio approach to improve the fracture behavior of Mo thin films by alloying with Cu
    T. Joerg, D. Music, M.J. Cordill, R. Franz, H. Koestenbauer, C. Linke, J. Winkler, J.M. Schneider, C. Mitterer
    Appl. Phys. Lett.111, ARTN 134101 (2017)
  • Deformation behavior of Re alloyed Mo thin films on flexible substrates: In situ fragmentation analysis supported by first-principles calculations
    T. Joerg, D. Music, F. Hauser, M.J. Cordill, R. Franz, H. Koestenbauer, J. Winkler, J.M. Schneider, C. Mitterer
    Sci Rep7, ARTN 7374 (2017)
  • Film thickness dependent microstructural changes of thick copper metallizations upon thermal fatigue
    S. Bigl, C.O.W. Trost, S. Wurster, M.J. Cordill, D. Kiener
    J. Mater. Res.32, 2022-2034 (2017)
  • Thickness dependence of the electro-mechanical response of sputter deposited Mo thin films on polyimide: Insights from in situ synchrotron diffraction tensile tests
    T. Joerg, M.J. Cordill, R. Franza, C. Kirchlechner, D.M. Toebbens, J. Winkler, C. Mitterer
    Mater. Sci. Eng. A-Struct. Mater. Prop. Microstruct. Process.697, 17-23 (2017)