
Priv. Doz. Dr. Megan J. Cordill
Function: Vice Director
Room: 308
Phone: +43 (0) 3842-804-308
E-Mail: megan.cordill(at)oeaw.ac.at
Research
Complex Materials, Micro- and Nanomechanics, Micro- and Nanostructure Characterization
Methods
Nanoindentation, electro-mechanical in-situ testing, AFM, CLSM, electrical measurement, thin films, adhesion
Teaching
Mechanics in Small Dimensions (Mechanik in kleinen Dimensionen), Übungen zu Materialkundliche Arbeitsverfahren
Projects
FLEX-E-TEST, Adhesion Techniques for Films on Flexible Substrates, High cycle thermo-mechanical fatigue behavior of semiconductor thin films, EPPL - Enhanced Power Pilot Line
Publications
- Die Elektronik dehnen, bis sie bricht
Die Presse (2017) - A correlative experimental and ab initio approach to improve the fracture behavior of Mo thin films by alloying with Cu
Appl. Phys. Lett.111, ARTN 134101 (2017) - Deformation behavior of Re alloyed Mo thin films on flexible substrates: In situ fragmentation analysis supported by first-principles calculations
Sci Rep7, ARTN 7374 (2017) - Film thickness dependent microstructural changes of thick copper metallizations upon thermal fatigue
J. Mater. Res.32, 2022-2034 (2017) - Thickness dependence of the electro-mechanical response of sputter deposited Mo thin films on polyimide: Insights from in situ synchrotron diffraction tensile tests
Mater. Sci. Eng. A-Struct. Mater. Prop. Microstruct. Process.697, 17-23 (2017) - Designing a novel functional-structural NiTi/hydroxyapatite composite with enhanced mechanical properties and high bioactivity
Intermetallics84, 35-41 (2017) - Monotonic and cyclic mechanical reliability of metallization lines on polymer substrates
J. Mater. Res.32, 1760-1769 (2017) - A versatile atomic force microscope integrated with a scanning electron microscope
Rev. Sci. Instrum.88, ARTN 053704 (2017) - Explicit relationship between electrical and topological degradation of polymer-supported metal films subjected to mechanical loading
Appl. Phys. Lett.110, ARTN 191904 (2017) - Thin film adhesion of flexible electronics influenced by interlayers
Advanced Engineering Materials19, 1-7 (2017)