Priv. Doz. Dr. Megan J. Cordill

Function: Vice Director
Room: 308
Phone: +43 (0) 3842-804-308
E-Mail: megan.cordill(at)oeaw.ac.at

Research

Complex Materials, Micro- and Nanomechanics, Micro- and Nanostructure Characterization

Methods

Nanoindentation, electro-mechanical in-situ testing, AFM, CLSM, electrical measurement, thin films, adhesion

Teaching

Mechanics in Small Dimensions (Mechanik in kleinen Dimensionen), Übungen zu Materialkundliche Arbeitsverfahren

Projects

FLEX-E-TEST, Adhesion Techniques for Films on Flexible Substrates, High cycle thermo-mechanical fatigue behavior of semiconductor thin films, EPPL - Enhanced Power Pilot Line

Publications

  • Compressive and tensile bending of sputter deposited Al/Mo bilayers
    P. Kreiml, M. Rausch, V. Terziyska, J. Winkler, C. Mitterer, M. Cordill
    Scripta Materialia162, 367-371 (2019)
    DOIRISENWBIB
  • Electromechanical properties of cathodic arc deposited high entropy alloy thin films on polymer substrates
    A. Xia, O. Glushko, M.J. Cordill, R. Franz
    J. Vac. Sci. Technol. A37, ARTN 010601 (2019)
    DOIRISENWBIB
  • Compressive and tensile bending of sputter deposited Al/Mo bilayers
    P. Kreiml, M. Rausch, V. Terziyska, J. Winkler, C. Mitterer, M.J. Cordill
    Scripta Materialia, 367-271 (2018)
    DOIRISENWBIB
  • Electro-mechanical behavior of Al/Mo bilayers studied with in situ straining methods
    P. Kreiml, M. Rausch, V.L. Terziyska, H. Koestenbauer, J. Winkler, C. Mitterer, M.J. Cordill
    Thin Solid Films665, 131-136 (2018)
    DOIRISENWBIB
  • Sputter deposition of Mo-based multicomponent thin films from rotatable targets: Experiment and simulation
    M. Rausch, M. Pavlovic, P. Kreiml, M.J. Cordill, J. Winkler, C. Mitterer
    Appl. Surf. Sci.455, 1029-1036 (2018)
    DOIRISENWBIB
  • Scratch induced thin film buckling for quantitative adhesion measurements
    A. Kleinbichler, M.J. Pfeifenberger, J. Zechner, S. Woehlert, M.J. Cordill
    Mater. Des.155, 203-211 (2018)
    DOIRISENWBIB
  • In-situ observations of the fracture and adhesion of Cu/Nb multilayers on polyimide substrates
    M.J. Cordill, A. Kleinbichler, B. Voelker, P. Kraker, D.R. Economy, D. Toebbens, C. Kirchlechner, M.S. Kennedy
    Mater. Sci. Eng. A-Struct. Mater. Prop. Microstruct. Process.735, 456-462 (2018)
    DOIRISENWBIB
  • Crack Initiation of Printed Lines Predicted with Digital Image Correlation
    C. Katsarelis, O. Glushko, C. Tonkin, M.S. Kennedy, M.J. Cordill
    JOM70, 1805-1810 (2018)
    DOIRISENWBIB
  • Molecularly grafted, structurally integrated multifunctional polymer thin films with improved adhesion
    A. Lassnig, N. Nakamura, T. Joerg, B. Reeja-Jayan, M.J. Cordill
    Surf. Coat. Technol.349, 963-968 (2018)
    DOIRISENWBIB
  • Mechanical Behavior at the Nanoscale: What's in your Toolbox?
    M.J. Cordill, C.R. Weinberger
    JOM70, 1065-1067 (2018)
    DOIRISENWBIB